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Manufacturer | STMicroelectronics |
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Manufacturer's Part Number | NAND512R3A2CZB6 |
Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 55; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD; |
Datasheet | NAND512R3A2CZB6 Datasheet |
In Stock | 2,419 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 64MX8 |
Maximum Seated Height: | 1.2 mm |
Programming Voltage (V): | 1.8 |
Minimum Supply Voltage (Vsup): | 1.7 V |
Surface Mount: | YES |
Terminal Finish: | TIN LEAD |
No. of Terminals: | 55 |
No. of Words: | 67108864 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B55 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | ASYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | TFBGA |
Width: | 8 mm |
Memory Density: | 536870912 bit |
Memory IC Type: | FLASH |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 8 |
No. of Functions: | 1 |
Type: | SLC NAND TYPE |
Qualification: | Not Qualified |
Length: | 10 mm |
Maximum Access Time: | 35 ns |
No. of Words Code: | 64M |
Nominal Supply Voltage / Vsup (V): | 1.8 |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 1.95 V |