STMicroelectronics - NAND512R4B3CZA6

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NAND512R4B3CZA6 by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number NAND512R4B3CZA6
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.05 mm;
Datasheet NAND512R4B3CZA6 Datasheet
In Stock1,914
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 32MX16
Maximum Seated Height: 1.05 mm
Programming Voltage (V): 1.8
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 63
No. of Words: 33554432 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B63
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 9.5 mm
Memory Density: 536870912 bit
Memory IC Type: FLASH
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Memory Width: 16
No. of Functions: 1
Qualification: Not Qualified
Length: 12 mm
Maximum Access Time: 35 ns
No. of Words Code: 32M
Nominal Supply Voltage / Vsup (V): 1.8
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 1.95 V
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