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Manufacturer | STMicroelectronics |
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Manufacturer's Part Number | SP1ML-868 |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; |
Datasheet | SP1ML-868 Datasheet |
In Stock | 437 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.8 V |
Package Body Material: | UNSPECIFIED |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | 3 V |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Supply Voltage: | 3.6 V |
Maximum Seated Height: | 2.5 mm |
Surface Mount: | NO |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 16 |
Terminal Position: | DUAL |
Package Style (Meter): | MICROELECTRONIC ASSEMBLY |
Length: | 14 mm |
Technology: | CMOS |
JESD-30 Code: | R-XDMA-N16 |
Package Shape: | RECTANGULAR |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Width: | 13.4 mm |
Terminal Pitch: | 1.5 mm |
Temperature Grade: | INDUSTRIAL |