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| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | SP1ML-868 |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; |
| Datasheet | SP1ML-868 Datasheet |
| In Stock | 437 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.8 V |
| Other Names: |
-1138-SP1ML-868 497-15395 |
| Package Body Material: | UNSPECIFIED |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Nominal Supply Voltage: | 3 V |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Supply Voltage: | 3.6 V |
| Maximum Seated Height: | 2.5 mm |
| Surface Mount: | NO |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 16 |
| Terminal Position: | DUAL |
| Package Style (Meter): | MICROELECTRONIC ASSEMBLY |
| Length: | 14 mm |
| Technology: | CMOS |
| JESD-30 Code: | R-XDMA-N16 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Width: | 13.4 mm |
| Terminal Pitch: | 1.5 mm |
| Temperature Grade: | INDUSTRIAL |









