STMicroelectronics - SPC563M60B2CBR

SPC563M60B2CBR by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number SPC563M60B2CBR
Description Microcontrollers; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 208; Package Code: BGA; Package Shape: SQUARE;
Datasheet SPC563M60B2CBR Datasheet
In Stock3,076
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 195 mA
No. of Terminals: 208
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B208
Package Shape: SQUARE
ROM Words: 1048576
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: BGA
Speed: 64 rpm
RAM Bytes: 65536
Bit Size: 32
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA208,16X16,40
ROM Programmability: FLASH
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 1.2,3.3,5
CPU Family: SPC56
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