STMicroelectronics - SPC56EL60C3CBF

SPC56EL60C3CBF by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number SPC56EL60C3CBF
Description Microcontrollers; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 257; Package Code: FBGA; Package Shape: SQUARE;
Datasheet SPC56EL60C3CBF Datasheet
In Stock4,777
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Sub-Category: Microcontrollers
Surface Mount: YES
No. of Terminals: 257
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
JESD-30 Code: S-PBGA-B257
Package Shape: SQUARE
ROM Words: 1048576
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: FBGA
Data EEPROM Size: 0
Speed: 120 rpm
RAM Bytes: 131072
Peripherals: DMA(16), POR, PWM(8), TIMER(18), WDT
Bit Size: 32
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA257,17X17,32
On Chip Program ROM Width: 8
Connectivity: CAN(2), FLEXRAY, LIN(2), SPI(3), UART(2)
ROM Programmability: FLASH
Analog To Digital Convertors: 16-Ch 12-Bit
Terminal Pitch: .8 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 3.3
CPU Family: E200Z4
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