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Manufacturer | STMicroelectronics |
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Manufacturer's Part Number | SPC56EL60C3CBF |
Description | Microcontrollers; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 257; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | SPC56EL60C3CBF Datasheet |
In Stock | 4,777 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3.3 V |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
No. of Terminals: | 257 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
JESD-30 Code: | S-PBGA-B257 |
Package Shape: | SQUARE |
ROM Words: | 1048576 |
Terminal Form: | BALL |
Maximum Operating Temperature: | 125 Cel |
Package Code: | FBGA |
Data EEPROM Size: | 0 |
Speed: | 120 rpm |
RAM Bytes: | 131072 |
Peripherals: | DMA(16), POR, PWM(8), TIMER(18), WDT |
Bit Size: | 32 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA257,17X17,32 |
On Chip Program ROM Width: | 8 |
Connectivity: | CAN(2), FLEXRAY, LIN(2), SPI(3), UART(2) |
ROM Programmability: | FLASH |
Analog To Digital Convertors: | 16-Ch 12-Bit |
Terminal Pitch: | .8 mm |
Temperature Grade: | AUTOMOTIVE |
Power Supplies (V): | 3.3 |
CPU Family: | E200Z4 |