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Manufacturer | STMicroelectronics |
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Manufacturer's Part Number | ST20196 |
Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 208; Package Code: LBGA; Package Shape: SQUARE; |
Datasheet | ST20196 Datasheet |
In Stock | 4,037 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.2 V |
Maximum Seated Height: | 1.7 mm |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 208 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE |
Data Rate: | 24 Mbps |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B208 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | LBGA |
Width: | 17 mm |
Telecom IC Type: | TELECOM CIRCUIT |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA208,16X16,40 |
Length: | 17 mm |
Terminal Pitch: | 1 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 1.2,3.3 |