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| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | ST25TA02KP-C6G5 |
| Description | MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: ROUND; No. of Words: 262144 words; Surface Mount: YES; |
| Datasheet | ST25TA02KP-C6G5 Datasheet |
| In Stock | 1,374 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Memory Density: | 2097152 bit |
| Organization: | 256KX8 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Surface Mount: | YES |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| No. of Words: | 262144 words |
| Terminal Position: | UPPER |
| Package Style (Meter): | UNCASED CHIP |
| Technology: | CMOS |
| No. of Words Code: | 256K |
| JESD-30 Code: | O-XUUC-N |
| Package Shape: | ROUND |
| Terminal Form: | NO LEAD |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | DIE |
| Temperature Grade: | INDUSTRIAL |
