STMicroelectronics - ST33TPM12LPCQFN

P1014NXE5HFB by NXP Semiconductors is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 100 MHz. This processor features low power mode and boundary scan capabilities, making it ideal for applications requiring high-speed processing in compact devices. With a package style of grid array and fine pitch, this chip offers advanced performance in a small form factor.

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 245; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 30;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Width: 25 mm;

PPC440EP-3JC400C by Applied Micro Circuits is a 32-bit microprocessor with integrated cache and operates at a max clock frequency of 66.66 MHz. It features a package style of GRID ARRAY and is commonly used in applications requiring high-speed processing, such as networking equipment and embedded systems.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 740; Package Code: LBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

MICROCONTROLLER, RISC; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER; JESD-609 Code: e2;

Qualcomm's APQ-8016E-1-760NSP-TR-01-0 microprocessor features 760 terminals, operates b/w -30 to 60 °C, and has a peak reflow temp of 255C. Ideal for applications requiring a CMOS RISC processor with a very thin profile and fine pitch grid array package style.

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: QFP; Package Shape: SQUARE;

The NXP Semiconductors T2080NXE8TTB microprocessor features a 64-bit architecture, integrated cache, and operates at speeds up to 1800 rpm. Ideal for industrial applications, this CMOS technology-based processor has a temperature range of -40 to 105°C and comes in a square package with 896 terminals for surface mount assembly.

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;

NXP's MIMXRT1024DAG5A microprocessor features 32-bit architecture, 262144 RAM words, and a max clock frequency of 24 MHz. Ideal for low power applications with its integrated cache, it offers 3.6V max supply voltage and operates b/w 0-95°C.

The NXP Semiconductors MPC8313CVRADDC is a 32-bit microprocessor with integrated cache, operating at a max frequency of 66.67 MHz. It features a 32-bit external data bus width and supports low power mode, making it ideal for industrial applications requiring high-speed processing in compact form factors.

Analog Devices' ADSP-BF609BBCZ-5X microprocessor features integrated cache, 16-bit external data bus width, and operates at a speed of 500 rpm. Ideal for industrial applications requiring low power mode and fixed-point format processing.

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 217; Package Code: LFBGA; Package Shape: SQUARE;

NXP Semiconductors' MCF5235CVM150 microprocessor features 32-bit architecture, 24-bit address bus width, and a max clock frequency of 75 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

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The NXP Semiconductors MPC8308VMAGDA microprocessor features integrated cache, operates at a max clock frequency of 66.67 MHz, and supports low power mode. Ideal for applications requiring high-speed processing in a compact form factor with a square package shape and 473 terminals.

The Texas Instruments DM3725CBPDR100 microprocessor features a 26-bit address bus, 16-bit external data bus, and integrated cache. Ideal for industrial applications requiring a max clock frequency of 54 MHz and low power mode capability. Package style is grid array with very thin profile and fine pitch terminals.

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;