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| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | ST60A2G0C1C7GYO |
| Description | TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 25; Package Code: VFBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; |
| Datasheet | ST60A2G0C1C7GYO Datasheet |
| In Stock | 3,783 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.45 V |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .9 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 25 |
| Package Equivalence Code: | BGA25,5X5,16 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Data Rate: | 100 Mbps |
| Length: | 2.2 mm |
| JESD-30 Code: | S-PBGA-B25 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Additional Features: | also operates with 1.8v supply |
| Maximum Operating Temperature: | 105 Cel |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | VFBGA |
| Width: | 2.2 mm |
| Terminal Pitch: | .4 mm |
