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| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | ST7570 |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: HVFQFP; Package Shape: SQUARE; |
| Datasheet | ST7570 Datasheet |
| In Stock | 593 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 13 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | .03 mA |
| Terminal Finish: | Matte Tin (Sn) - annealed |
| No. of Terminals: | 48 |
| Terminal Position: | QUAD |
| Package Style (Meter): | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PQFP-G48 |
| Package Shape: | SQUARE |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | HVFQFP |
| Width: | 7 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Telecom IC Type: | TELECOM CIRCUIT |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | LCC48,.27SQ,20 |
| Length: | 7 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 13 |
