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Manufacturer | STMicroelectronics |
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Manufacturer's Part Number | STA264 |
Description | Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 249; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | STA264 Datasheet |
In Stock | 4,880 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 249 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA249,17X17,32 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
JESD-30 Code: | S-PBGA-B249 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |