Image shown is a representation only.
| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | STA8088EXG |
| Description | CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: FBGA; Package Shape: SQUARE; |
| Datasheet | STA8088EXG Datasheet |
| In Stock | 2,778 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Sub-Category: | Other Consumer ICs |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER NICKEL |
| JESD-609 Code: | e2 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 169 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA169,13X13,25 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B169 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | FBGA |
| General IC Type: | CONSUMER CIRCUIT |
| Terminal Pitch: | .635 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 1.2,1.8/3.3 |
| Moisture Sensitivity Level (MSL): | 3 |
