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| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | STA8090FGB |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 99; Package Code: TFBGA; Package Shape: RECTANGULAR; |
| Datasheet | STA8090FGB Datasheet |
| In Stock | 1,459 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
STA8090FGB-ND 497-19144 497-19144-ND 497-STA8090FGB -1138-STA8090FGB |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.2 V |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 1.2 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 99 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Length: | 6 mm |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B99 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | TFBGA |
| Width: | 5 mm |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
