STMicroelectronics - STLC60845

STLC60845 by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number STLC60845
Description TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
Datasheet STLC60845 Datasheet
In Stock2,063
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Telecom IC Type: TELECOM CIRCUIT
Surface Mount: YES
No. of Functions: 1
No. of Terminals: 292
Qualification: Not Qualified
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B292
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
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