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| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | STPAC01F1 |
| Description | TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 8; Package Code: VFBGA; Package Shape: SQUARE; |
| Datasheet | STPAC01F1 Datasheet |
| In Stock | 4,317 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 2.7 V |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .715 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -30 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 8 |
| Qualification: | Not Qualified |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Length: | 1.57 mm |
| JESD-30 Code: | S-XBGA-B8 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | VFBGA |
| Width: | 1.57 mm |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | OTHER |
