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| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | STR710FZ1H6 |
| Description | MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: LFBGA; Package Shape: SQUARE; |
| Datasheet | STR710FZ1H6 Datasheet |
| In Stock | 132 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 3 V |
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Sub-Category: | Microcontrollers |
| Surface Mount: | YES |
| Address Bus Width: | 24 |
| Technology: | CMOS |
| Maximum Clock Frequency: | 16.5 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | LFBGA |
| Moisture Sensitivity Level (MSL): | 3 |
| Bit Size: | 32 |
| DAC Channels: | NO |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA144,12X12,32 |
| PWM Channels: | YES |
| Connectivity: | CAN, I2C(2), SMARTCARD, SPI(2), UART(4), USB |
| Peak Reflow Temperature (C): | 260 |
| ROM Programmability: | FLASH |
| Analog To Digital Convertors: | 4-Ch 12-Bit |
| Terminal Pitch: | .8 mm |
| CPU Family: | ARM7 |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Seated Height: | 1.7 mm |
| Maximum Supply Current: | 100 mA |
| Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
| ADC Channels: | YES |
| No. of Terminals: | 144 |
| DMA Channels: | NO |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| No. of I/O Lines: | 48 |
| JESD-30 Code: | S-PBGA-B144 |
| ROM Words: | 32768 |
| Maximum Operating Temperature: | 85 Cel |
| Width: | 10 mm |
| Data EEPROM Size: | 16K |
| Speed: | 66 rpm |
| Peripheral IC Type: | MICROCONTROLLER, RISC |
| Maximum Supply Voltage: | 3.6 V |
| RAM Bytes: | 32768 |
| External Data Bus Width: | 16 |
| Peripherals: | RTC, TIMER(5) |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Length: | 10 mm |
| On Chip Program ROM Width: | 32 |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3.3 |
