TDA75613LV by STMicroelectronics | General Purpose ICs

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Manufacturer	STMicroelectronics
Manufacturer's Part Number	TDA75613LV
Description	AUDIO AMPLIFIER; Terminal Form: THROUGH-HOLE; No. of Terminals: 27; Package Code: ZFM; Package Shape: RECTANGULAR; Package Equivalence Code: ZIP27,.16,.16,40;
Datasheet	TDA75613LV Datasheet
In Stock	2,627

NAME	DESCRIPTION
Package Body Material:	UNSPECIFIED
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Maximum Seated Height:	19.37 mm
Minimum Supply Voltage (Vsup):	6 V
Surface Mount:	NO
No. of Terminals:	27
Terminal Position:	ZIG-ZAG
Package Style (Meter):	FLANGE MOUNT
Technology:	BCDMOS
JESD-30 Code:	R-XZFM-T27
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Maximum Operating Temperature:	105 Cel
No. of Channels:	4
Package Code:	ZFM
General IC Type:	AUDIO AMPLIFIER
Nominal Bandwidth:	.022 kHz
Width:	4.5 mm
Other Names:	TDA75613LV-ND 497-15413-5 -497-15413-5
Harmonic Distortion:	.02 %
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Package Equivalence Code:	ZIP27,.16,.16,40
Nominal Output Power:	64 W
Length:	29.23 mm
Peak Reflow Temperature (C):	NOT SPECIFIED
Terminal Pitch:	1 mm
Maximum Supply Voltage (Vsup):	18 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
2,627	$9.600	$25,219.200

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