TDA7577BLVSM by STMicroelectronics | General Purpose ICs

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Manufacturer	STMicroelectronics
Manufacturer's Part Number	TDA7577BLVSM
Description	AUDIO AMPLIFIER; Terminal Form: THROUGH-HOLE; No. of Terminals: 27; Package Code: ZFM; Package Shape: RECTANGULAR; Nominal Output Power: 155 W;
Datasheet	TDA7577BLVSM Datasheet
In Stock	1,736

NAME	DESCRIPTION
Package Body Material:	UNSPECIFIED
Maximum Seated Height:	4.65 mm
Minimum Supply Voltage (Vsup):	6 V
Surface Mount:	NO
Harmonic Distortion:	.3 %
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	27
Package Equivalence Code:	ZIP27H,.1,.74,40
Terminal Position:	ZIG-ZAG
Package Style (Meter):	FLANGE MOUNT
Nominal Output Power:	155 W
Length:	29.23 mm
JESD-30 Code:	R-XZFM-T27
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Maximum Operating Temperature:	105 Cel
No. of Channels:	2
Package Code:	ZFM
General IC Type:	AUDIO AMPLIFIER
Nominal Bandwidth:	.022 kHz
Width:	15.7 mm
Terminal Pitch:	1 mm
Maximum Supply Voltage (Vsup):	18 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,736	-	-

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