STMicroelectronics - TEA7062DP

TEA7062DP by STMicroelectronics

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Manufacturer	STMicroelectronics
Manufacturer's Part Number	TEA7062DP
Description	Other Telecom ICs; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Nominal Supply Voltage: 2.5 V;
Datasheet	TEA7062DP Datasheet
In Stock	3,737

TEA7062DP Technical Details

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	2.5 V
Sub-Category:	Other Telecom ICs
Surface Mount:	NO
Terminal Finish:	Tin/Lead (Sn/Pb)
JESD-609 Code:	e0
No. of Terminals:	18
Qualification:	Not Qualified
Package Equivalence Code:	DIP18,.3
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
JESD-30 Code:	R-PDIP-T18
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Package Code:	DIP
Terminal Pitch:	2.54 mm
Power Supplies (V):	2.5

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,737	-	-

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