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Manufacturer | STMicroelectronics |
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Manufacturer's Part Number | TS75C960CP-S |
Description | MODEM; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 48; Package Code: DIP; Package Shape: RECTANGULAR; |
Datasheet | TS75C960CP-S Datasheet |
In Stock | 4,824 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 5 V |
Sub-Category: | Other Telecom ICs |
Surface Mount: | NO |
Terminal Finish: | TIN LEAD |
No. of Terminals: | 48 |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Data Rate: | .0096 Mbps |
Technology: | CMOS |
JESD-30 Code: | R-PDIP-T48 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 70 Cel |
Package Code: | DIP |
Width: | 15.24 mm |
Telecom IC Type: | MODEM |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | 0 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP48,.6 |
Additional Features: | DATA RATE MIN:300BPS |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 5 |