Taiwan Semiconductor - BZV55B22L1G

BZV55B22L1G by Taiwan Semiconductor

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Manufacturer Taiwan Semiconductor
Manufacturer's Part Number BZV55B22L1G
Description ZENER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Datasheet BZV55B22L1G Datasheet
NAME DESCRIPTION
Package Body Material: GLASS
Working Test Current: 5 mA
Config: SINGLE
Diode Type: ZENER DIODE
Surface Mount: YES
Terminal Finish: MATTE TIN OVER NICKEL
Maximum Reverse Current: .1 uA
No. of Terminals: 2
Terminal Position: END
Package Style (Meter): LONG FORM
Technology: ZENER
JESD-30 Code: O-LELF-R2
No. of Elements: 1
Package Shape: ROUND
Terminal Form: WRAP AROUND
Polarity: UNIDIRECTIONAL
Maximum Operating Temperature: 175 Cel
Case Connection: ISOLATED
Maximum Knee Impedance: 220 ohm
Maximum Dynamic Impedance: 55 ohm
Moisture Sensitivity Level (MSL): 1
Reverse Test Voltage: 16 V
JESD-609 Code: e3
Minimum Operating Temperature: -65 Cel
Maximum Voltage Tolerance: 2 %
Diode Element Material: SILICON
Nominal Reference Voltage: 22 V
Maximum Power Dissipation: .5 W
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