Taiwan Semiconductor - TSM6502CRRLG

TSM6502CRRLG by Taiwan Semiconductor

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Manufacturer Taiwan Semiconductor
Manufacturer's Part Number TSM6502CRRLG
Description N-CHANNEL AND P-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 40 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
Datasheet TSM6502CRRLG Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
Transistor Element Material: SILICON
Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR
Transistor Application: SWITCHING
Maximum Drain Current (ID): 5.4 A
Maximum Pulsed Drain Current (IDM): 96 A
Surface Mount: YES
No. of Terminals: 6
Maximum Power Dissipation (Abs): 40 W
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
JESD-30 Code: R-PDSO-F6
No. of Elements: 2
Package Shape: RECTANGULAR
Terminal Form: FLAT
Operating Mode: ENHANCEMENT MODE
Maximum Operating Temperature: 150 Cel
Case Connection: DRAIN
Maximum Power Dissipation Ambient: 2 W
Maximum Drain-Source On Resistance: .034 ohm
Moisture Sensitivity Level (MSL): 1
Avalanche Energy Rating (EAS): 24 mJ
Maximum Feedback Capacitance (Crss): 15 pF
Polarity or Channel Type: N-CHANNEL AND P-CHANNEL
Minimum Operating Temperature: -55 Cel
Minimum DS Breakdown Voltage: 60 V
Maximum Drain Current (Abs) (ID): 24 A
Peak Reflow Temperature (C): 260
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