TE Connectivity - 5-1437536-6

Omron's P2CF-11-E chip carrier IC socket has 11 contacts, 5A current rating, and 1 billion ohm insulation resistance. It is used for relay devices with screw termination, offering a dielectric voltage of 2000VAC. Ideal for applications requiring a reliable and high-performance relay socket solution.

IC SOCKET;

Mill-max Mfg 311-99-113-41-001000 is a PLASTIC IC SOCKET for SIP13 devices with 13 contacts. Features TIN LEAD (200) mating finish and Tin/Lead termination. Ideal for Chip Carrier IC & Component Sockets applications.

Samtec's ALC-640-STT is a Chip Carrier IC Socket with 40 contacts, 15.24mm PCB row spacing, and brass housing material. It is used for DIP40 devices, featuring solder termination and a mating contact pitch of 0.1". Ideal for applications requiring reliable connections in electronic circuits.

110-83-314-41-001101 by Preci-dip Sa is a DIP14 IC socket with 14 contacts, rated for 1A current. It features Beryllium Copper contact material, Gold mating finish, and Tin termination finish. With a PCB contact row spacing of 7.62mm, it has a dielectric voltage of 1400VAC and operates b/w -55°C to 125°C. Ideal for chip carrier IC applications due to its high insulation resistance and durable housing material.

IC SOCKET; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;

214-44-308-01-670799 by Mill-max Mfg is a NYLON46 IC SOCKET for DIP8 devices with 8 contacts. It features MATTE TIN OVER NICKEL finish, ideal for Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.

RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;

RELAY SOCKET;

TE Connectivity's 2-1571552-6 is a DIP20 IC socket with 20 contacts, rated at 3A current. It features a PCB contact row spacing of 7.62mm and rectangular pattern, suitable for applications requiring a dielectric voltage withstand of 1400VAC. The socket has a solder termination type and operates b/w -55°C to 105°C, making it ideal for various electronic devices.

RELAY SOCKET; Device Type Used On: RELAY; Rating (Current): 10 A; Maximum Operating Temperature: 85 Cel; Body Length: 2.95 inch; Body Width: 1.496 inch;

IC SOCKET; Housing Material: NYLON; No. of Contacts: 14; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SCREW;

TE Connectivity's 1-1571994-0 is a RECTANGULAR Chip Carrier IC Socket made of THERMOPLASTIC POLYESTER. With 10 RND PIN-SKT contacts on a 0.1" pitch, it's used for SIP10 devices with SOLDER termination, ideal for PCB applications.

IC SOCKET; Device Type Used On: SOIC8-DIP8; Contact Finish (Mating): GOLD OVER NICKEL; Contact Material: NOT SPECIFIED; Additional Features: SOCKET ADAPTER; No. of Contacts: 8;

150-10-640-00-106161 by Preci-dip Sa is a DIP40 IC socket with 40 brass contacts, gold finish, and surface mount termination. It has a contact pitch of 0.1 inch and operates b/w -55°C to 125°C. Ideal for chip carrier ICs, this socket offers high insulation resistance and dielectric voltage withstand capabilities.

Samtec's HLT-1015-G-H is a plastic IC socket with 150 brass contacts, gold finish over nickel for mating, and gold with nickel termination. It is designed for use on PGA150 devices, offering reliable connectivity in chip carrier applications.

The Mill-max Mfg 304-13-142-41-770000 is a POLYETHYLENE chip carrier IC socket for SIP42 devices with 42 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact configuration, and is ideal for electronic applications requiring reliable connections.

IC SOCKET; No. of Contacts: 2; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; Termination Type: SOLDER;

RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;

110-87-328-41-001101 by Preci-dip Sa is a DIP28 IC socket with 28 contacts, Beryllium Copper contact material, and Gold Flash finish. It has a PCB contact row spacing of 7.62mm and operates b/w -55°C to 125°C. Ideal for chip carrier applications requiring high insulation resistance and dielectric voltage withstand capabilities.