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| Manufacturer | Telcom Semiconductor |
|---|---|
| Manufacturer's Part Number | 4860 |
| Description | SAMPLE AND HOLD CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; |
| Datasheet | 4860 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | Ceramic |
| Sub-Category: | Sample and Hold Circuits |
| Surface Mount: | No |
| JESD-609 Code: | e0 |
| Terminal Finish: | Tin/Lead (Sn/Pb) |
| Minimum Operating Temperature: | 0 °C (32 °F) |
| No. of Functions: | 1 |
| No. of Terminals: | 24 |
| Qualification: | No |
| Package Equivalence Code: | DIP24,.6 |
| Terminal Position: | Dual |
| Package Style (Meter): | In Line |
| Technology: | Hybrid |
| JESD-30 Code: | R-XDIP-T24 |
| Package Shape: | Rectangular |
| Terminal Form: | Through-Hole |
| Maximum Operating Temperature: | 70 °C (158 °F) |
| Package Code: | DIP |
| Amplifier Type: | Sample And Hold Circuit |
| Terminal Pitch: | 0.1 in (2.54 mm) |
| Temperature Grade: | Commercial |
| Power Supplies (V): | 5,±15 V |
