Texas Instruments - 5962-9560901QYA

CD74HC40105E by Texas Instruments is a 16x4 FIFO memory IC with 500ns cycle time, operating at 10MHz clock frequency. It has 3-state output characteristics and supports parallel operation. Ideal for military-grade applications requiring fast data storage and retrieval in a compact IN-LINE package.

NXP Semiconductors' 74HC40105D,653 FIFO chip operates asynchronously with a cycle time of 71.428 ns and a clock frequency of up to 14 MHz. This CMOS technology device has a memory width of 4 bits and is ideal for automotive applications due to its wide temperature range from -40°C to 125°C.

SN74ACT3638-30PQR by Texas Instruments is a FIFO with 512x32 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring synchronous operation, such as data buffering and communication systems. The device features a flatpack package style, operates in commercial temperature grade range of 0 to 70 °C, and offers 3-STATE output characteristics.

74HC40105N,652 by NXP Semiconductors is a FIFO IC with 16x4 organization, operating at 14 MHz clock frequency. It has a cycle time of 71.428 ns and supports an asynchronous mode. This CMOS technology device is ideal for automotive applications due to its wide temperature range and memory width of 4 bits.

CY7C4265-10AXI by Cypress Semiconductor is a 16Kx18 FIFO with 10ns cycle time, operating at 100MHz. It has a memory density of 294912 bits and supports parallel operation. Ideal for industrial applications requiring fast data processing and storage in compact spaces.

SN74ACT3641-30PQR by Texas Instruments is a FIFO with 1KX36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 3-STATE output characteristics. Ideal for commercial temperature grade environments, this device offers parallel access with a memory width of 36 bits.

SN74ABT3612-20PQ by Texas Instruments is a 64x36 bi-directional FIFO memory IC with a cycle time of 20 ns and max clock frequency of 50 MHz. It operates in synchronous mode, has a memory density of 2304 bit, and supports parallel data transfer. This device is ideal for applications requiring fast and efficient data storage and retrieval in commercial temperature environments.

OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE; Memory Density: 36864 bit;

SN74ABT7819-12PNR by Texas Instruments is a FIFO with 512x18 organization, 12.5 ns cycle time, and operates at 5V. It is used in applications requiring fast synchronous data transfer, such as high-speed communication systems or memory buffering. The device features a low profile flatpack package with gull wing terminals for easy surface mounting.

SN74ACT3622-15PQG4 by Texas Instruments is a FIFO memory with 256x36 organization, operating at 66.7MHz cycle time of 15ns. It features a CMOS technology, suitable for parallel applications in commercial temperature range. The device has a package style of flatpack and bumper, with terminal finish in nickel palladium gold.

The Texas Instruments 5962-9560801NXD FIFO operates synchronously with a cycle time of 20ns and a clock frequency of 50MHz. It features a memory density of 36864 bit, suitable for military-grade applications requiring fast data processing and storage in harsh environments.

SN74ACT3651-20PQ by Texas Instruments is a 2Kx36 CMOS FIFO memory IC with 20ns cycle time, operating at 5V. It features synchronous operation, 50MHz clock frequency, and 3-STATE output characteristics. Ideal for applications requiring high-speed data buffering and storage in commercial temperature environments.

SN74V245-7PAG by Texas Instruments is a FIFO with 4Kx18 organization, operating at 166MHz. It features a cycle time of 7.5ns, synchronous mode, and 3-state output characteristics. This memory IC type is suitable for applications requiring fast data transfer and parallel operation in commercial temperature environments.

SN74ACT72211L-25RJR by Texas Instruments is a 512x9 FIFO chip with 25ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and an output enable function. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

SN74ACT7204L25NP by Texas Instruments is a FIFO memory with 4Kx9 organization, operating at 28.8 MHz clock frequency and 35 ns cycle time. It has a memory density of 36864 bits and is suitable for applications requiring fast asynchronous data storage and retrieval in commercial temperature environments.

The Renesas Electronics 72V221L15PFGI8 FIFO features a cycle time of 15 ns, operating at a max clock frequency of 66.7 MHz. With an organization of 1KX9, it is ideal for industrial applications requiring fast data processing and synchronous operation in a compact flatpack package style.

SN74ACT7204L-50RJR by Texas Instruments is a 4Kx9 FIFO chip with 65ns cycle time, operating at 5V. It features a 3-STATE output and operates in parallel mode. This CMOS technology chip is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

SN74ACT7201LA-25RJ by Texas Instruments is a FIFO chip with 512x9 organization, 35ns cycle time, and 28.5MHz clock frequency. It operates asynchronously and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

CD74HCT40105M96 by Texas Instruments is a 16x4 FIFO memory IC with 64-bit memory density and 10 MHz max clock frequency. Operating at -55 to 125 °C, it's ideal for military-grade applications requiring fast data storage and retrieval. With synchronous operation and output enable feature, this CMOS technology-based device offers reliable parallel data processing in compact small outline packaging.

SN54ACT7881HV by Texas Instruments is a 1Kx18 FIFO with 20ns cycle time, operating at 5V. It features synchronous operation, parallel interface, and output enable function. Ideal for military applications due to its wide temperature range (-55 to 125 °C) and ceramic package body material.