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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | 66AK2H12DAAW24 |
| Description | MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | 66AK2H12DAAW24 Datasheet |
| In Stock | 4,719 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .95 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 3.62 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 1517 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| No. of I/O Lines: | 32 |
| Address Bus Width: | 32 |
| Technology: | CMOS |
| RAM Words: | 6M |
| JESD-30 Code: | S-PBGA-B1517 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Width: | 40 mm |
| Moisture Sensitivity Level (MSL): | 4 |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Supply Voltage: | 1.05 V |
| Boundary Scan: | YES |
| External Data Bus Width: | 128 |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | 0 Cel |
| Length: | 40 mm |
| Peak Reflow Temperature (C): | 245 |
| Bus Compatibility: | ETHERNET; I2C; PCI; SPI; UART; USB |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | OTHER |
