Texas Instruments - 66AK2L06XCMSA2

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66AK2L06XCMSA2 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number 66AK2L06XCMSA2
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: FBGA; Package Shape: SQUARE;
Datasheet 66AK2L06XCMSA2 Datasheet
In Stock1,272
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.05 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 3.55 mm
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals: 900
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B900
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Package Code: FBGA
Width: 25 mm
Moisture Sensitivity Level (MSL): 4
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 1.1 V
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Length: 25 mm
Peak Reflow Temperature (C): 245
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
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