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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | 74SSTUB32868ZRHR |
| Description | D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 176; Package Code: TFBGA; Package Shape: RECTANGULAR; |
| Datasheet | 74SSTUB32868ZRHR Datasheet |
| In Stock | 366 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.2 mm |
| Trigger Type: | POSITIVE EDGE |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Sub-Category: | Other Logic ICs |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 176 |
| Maximum I (ol): | 8 Amp |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Maximum Frequency At Nominal Supply: | 410000000 Hz |
| Technology: | TTL |
| JESD-30 Code: | R-PBGA-B176 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Minimum fmax: | 410 MHz |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TFBGA |
| Propagation Delay At Nominal Supply: | 1 ns |
| Width: | 6 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| No. of Bits: | 28 |
| Output Polarity: | TRUE |
| Packing Method: | TR |
| Logic IC Type: | D FLIP-FLOP |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA176,8X22,25 |
| Length: | 15 mm |
| Propagation Delay (tpd): | 3 ns |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Family: | SSTU |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 1.9 V |
| Power Supplies (V): | 1.8 |
