Texas Instruments - AM3354BZCZ30

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AM3354BZCZ30 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number AM3354BZCZ30
Description MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet AM3354BZCZ30 Datasheet
In Stock7,147
NAME DESCRIPTION
Minimum Supply Voltage: 1.056 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.1 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.4 mm
Surface Mount: YES
Maximum Supply Current: 400 mA
Terminal Finish: TIN SILVER COPPER
On Chip Data RAM Width: 8
No. of Terminals: 324
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
No. of DMA Channels: 64
Address Bus Width: 28
Technology: CMOS
RAM Words: 131072
JESD-30 Code: S-PBGA-B324
Maximum Clock Frequency: 26 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 90 Cel
Package Code: LFBGA
Width: 15 mm
Moisture Sensitivity Level (MSL): 3
Speed: 300 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.144 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 16
Bit Size: 32
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Length: 15 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: OTHER
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