Texas Instruments - BBN6203BGNY30C

BBN6203BGNY30C by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number BBN6203BGNY30C
Description DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 384; Package Code: FBGA; Package Shape: SQUARE;
Datasheet BBN6203BGNY30C Datasheet
In Stock1,603
NAME DESCRIPTION
Minimum Supply Voltage: 1.43 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.5 V
Maximum Time At Peak Reflow Temperature (s): 20
Maximum Seated Height: 2.35 mm
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 384
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, FINE PITCH
Address Bus Width: 20
Technology: CMOS
JESD-30 Code: S-PBGA-B384
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 90 Cel
Package Code: FBGA
Width: 18 mm
Moisture Sensitivity Level (MSL): 4
Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER
Maximum Supply Voltage: 1.57 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Barrel Shifter: NO
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Internal Bus Architecture: MULTIPLE
Length: 18 mm
Peak Reflow Temperature (C): 220
Terminal Pitch: .8 mm
Temperature Grade: OTHER
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