Texas Instruments - BQ24250YFFT

BQ24250YFFT by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number BQ24250YFFT
Description POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 30; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
Datasheet BQ24250YFFT Datasheet
In Stock862
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Maximum Time At Peak Reflow Temperature (s): 30
Width (mm): 2.59 mm
Maximum Seated Height: .625 mm
Minimum Supply Voltage (Vsup): 4.35 V
Maximum Supply Current (Isup): 5 mA
Sub-Category: Power Management Circuits
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
Switcher Config: BUCK
No. of Terminals: 30
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
JESD-30 Code: R-XBGA-B30
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: VFBGA
Moisture Sensitivity Level (MSL): 1
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA30,5X6,16
Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT
Nominal Threshold Voltage (V): +3.35V
Length: 2.2 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .4 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 10.5 V
Power Supplies (V): 4.5/10
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