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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | BQ24251YFFR |
Description | POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 30; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES; |
Datasheet | BQ24251YFFR Datasheet |
In Stock | 813 |
NAME | DESCRIPTION |
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Package Body Material: | UNSPECIFIED |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Supply Current (Isup): | 5 mA |
Sub-Category: | Power Management Circuits |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 30 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
JESD-30 Code: | R-XBGA-B30 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | VFBGA |
Moisture Sensitivity Level (MSL): | 1 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA30,5X6,16 |
Other IC type: | POWER SUPPLY MANAGEMENT CIRCUIT |
Nominal Threshold Voltage (V): | +3.35V |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .4 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 4.5/10 |