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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | BQ24272YFFT |
Description | POWER SUPPLY MANAGEMENT CIRCUIT; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Form: BALL; Peak Reflow Temperature (C): 260; |
Datasheet | BQ24272YFFT Datasheet |
In Stock | 2,607 |
NAME | DESCRIPTION |
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Package Body Material: | UNSPECIFIED |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Minimum Supply Voltage (Vsup): | 4.2 V |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Switcher Config: | BUCK |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Other IC type: | POWER SUPPLY MANAGEMENT CIRCUIT |
JESD-30 Code: | R-XBGA-B49 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | VFBGA |
Maximum Supply Voltage (Vsup): | 10 V |
Moisture Sensitivity Level (MSL): | 1 |