Image shown is a representation only.
| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | BQ25970YFFR |
| Description | POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES; |
| Datasheet | BQ25970YFFR Datasheet |
| In Stock | 1,841 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Width (mm): | 2.8 mm |
| Maximum Seated Height: | .625 mm |
| Minimum Supply Voltage (Vsup): | 3.2 V |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 56 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| JESD-30 Code: | R-XBGA-B56 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| No. of Channels: | 1 |
| Package Code: | VFBGA |
| Moisture Sensitivity Level (MSL): | 1 |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Other IC type: | POWER SUPPLY SUPPORT CIRCUIT |
| Length: | 3.2 mm |
| Adjustable Threshold: | NO |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 12 V |
