Texas Instruments - BQ30Z55DBT-R1

BQ30Z55DBT-R1 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number BQ30Z55DBT-R1
Description Power Management Circuits; Temperature Grade: INDUSTRIAL; No. of Terminals: 30; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Datasheet BQ30Z55DBT-R1 Datasheet
In Stock909
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: Power Management Circuits
Surface Mount: YES
Terminal Finish: NICKEL PALLADIUM GOLD
JESD-609 Code: e4
Minimum Operating Temperature: -40 Cel
No. of Terminals: 30
Qualification: Not Qualified
Package Equivalence Code: TSSOP30,.25,20
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
JESD-30 Code: R-PDSO-G30
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Peak Reflow Temperature (C): 260
Package Code: TSSOP
Nominal Supply Voltage (Vsup): 14.4 V
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 14.4
Moisture Sensitivity Level (MSL): 2
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