BQ51011YFFR by Texas Instruments | Telecommunications

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Manufacturer	Texas Instruments
Manufacturer's Part Number	BQ51011YFFR
Description	TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 28; Package Code: VFBGA; Package Shape: RECTANGULAR;
Datasheet	BQ51011YFFR Datasheet
In Stock	3,939

NAME	DESCRIPTION
Package Body Material:	UNSPECIFIED
Nominal Supply Voltage:	5 V
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	.625 mm
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	28
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
JESD-30 Code:	R-XBGA-B28
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	125 Cel
Package Code:	VFBGA
Width:	1.56 mm
Moisture Sensitivity Level (MSL):	1
Telecom IC Type:	TELECOM CIRCUIT
JESD-609 Code:	e1
Minimum Operating Temperature:	0 Cel
No. of Functions:	1
Qualification:	Not Qualified
Length:	2.76 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	.4 mm
Temperature Grade:	OTHER

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,939	$4.010	$15,795.390

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