Texas Instruments - BUF602IDBVRG4

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BUF602IDBVRG4 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number BUF602IDBVRG4
Description BUFFER; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: LSSOP; Package Shape: RECTANGULAR; Maximum Average Bias Current (IIB): 8.5 uA;
Datasheet BUF602IDBVRG4 Datasheet
In Stock711
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 0.057 in (1.45 mm)
Maximum Supply Voltage Limit: 6.5 V
Maximum Bias Current (IIB) @25C: 3 uA
Maximum Supply Current: 7.2 mA
Surface Mount: Yes
Terminal Finish: Nickel PalladiumGold
No. of Terminals: 5
Minimum Slew Rate: 5000 V/us
Maximum Input Offset Voltage: 38 mV
Terminal Position: Dual
Package Style (Meter): Small Outline, Low Profile, Shrink Pitch
JESD-30 Code: R-PDSO-G5
Package Shape: Rectangular
Terminal Form: Gull Wing
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: LSSOP
Amplifier Type: Buffer
Width: 0.063 in (1.6 mm)
Moisture Sensitivity Level (MSL): 2
Packing Method: Tape And Reel
Nominal Negative Supply Voltage (Vsup): -5 V
Minimum Output Current: 48 A
Minimum Operating Temperature: -40 °C (-40 °F)
Maximum Average Bias Current (IIB): 8.5 uA
No. of Functions: 1
Package Equivalence Code: TSOP5/6,.11,37
Length: 0.114 in (2.9 mm)
Nominal Supply Voltage / Vsup (V): 5 V
Peak Reflow Temperature (C): 260 °C (500 °F)
Maximum Negative Supply Voltage Limit: -6.5 V
Terminal Pitch: 0.037 in (0.95 mm)
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