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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | CBP18SA46MJ |
| Description | OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-XDIP-T24; |
| Datasheet | CBP18SA46MJ Datasheet |
| In Stock | 4,387 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | CERAMIC |
| Organization: | 512X8 |
| Sub-Category: | OTP ROMs |
| Surface Mount: | NO |
| Maximum Supply Current: | 155 mA |
| No. of Terminals: | 24 |
| No. of Words: | 512 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Screening Level: | MIL-STD-883 Class B (Modified) |
| Technology: | TTL |
| JESD-30 Code: | R-XDIP-T24 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | DIP |
| Memory Density: | 4096 bit |
| Memory IC Type: | OTP ROM |
| Minimum Operating Temperature: | -55 Cel |
| Memory Width: | 8 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | DIP24,.6 |
| Maximum Access Time: | 85 ns |
| No. of Words Code: | 512 |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | MILITARY |
