Texas Instruments - CQF044-131A

  1. Home
  2. Texas Instruments - CQF044-131A
CQF044-131A by Texas Instruments

Image shown is a representation only.

Manufacturer Texas Instruments
Manufacturer's Part Number CQF044-131A
Description IC SOCKET; Device Type Used On: QFP44; Housing Material: GLASS FILLED POLYETHERIMIDE; Manufacturer Series: CQF; No. of Contacts: 44;
Datasheet CQF044-131A Datasheet
In Stock2,834
NAME DESCRIPTION
IC Socket Type: IC Socket
Housing Material: Glass-Filled Polyetherimide (PEI)
Device Type Used On: QFP44
Manufacturer Series: CQF
No. of Contacts: 44
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
2,834 - -

Popular Products

Category Top Products

200-6311-9UN-1900 by 3m Electronic Products Division

200-6311-9UN-1900

3m Electronic Products Division

The 3M Electronic Products Division's 200-6311-9UN-1900 is a Chip Carrier IC Socket with POLYETHERSULFONE housing. It features 121 BERYLLIUM COPPER contacts with GOLD (30) OVER NICKEL (50) finish for PGA121 devices. Ideal for high-performance electronic applications requiring reliable connections.
8444-21B1-RK-TR by 3m Electronic Products Division

8444-21B1-RK-TR

3m Electronic Products Division

IC SOCKET; Housing Material: GLASS FILLED POLYPHENYLENE SULFIDE; Contact Material: PHOSPHOR BRONZE; Contact Finish (Mating): MATTE TIN (160) OVER NICKEL (50); Additional Features: STANDARD: UL 94V-0; No. of Contacts: 44;
540-88-044-17-400-TR by Preci-dip Sa

540-88-044-17-400-TR

Preci-dip Sa

IC SOCKET; Device Type Used On: PLCC44; Housing Material: PPS THERMOPLASTIC; Additional Features: STANDARD: UL 94V-0, LOW PROFILE; No. of Contacts: 44; Contact Material: NOT SPECIFIED;
551-90-022-05-001005 by Mill-max Mfg

551-90-022-05-001005

Mill-max Mfg

Mill-max Mfg 551-90-022-05-001005 is a PGA22 IC socket with 22 contacts. It features TIN LEAD (200) mating finish and Tin/Lead termination with Nickel barrier. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it's ideal for Chip Carrier applications.
832-AG11D-ESL-LF by TE Connectivity

832-AG11D-ESL-LF

TE Connectivity

TE Connectivity's 832-AG11D-ESL-LF is a DIP32 IC socket with 32 contacts, rated at 3A current. Featuring a PCB contact row spacing of 15.24mm and rectangular pattern, it has a housing made of polyethylene/polyester. With a temperature range from -55 to 105 °C, it uses solder termination and has an insulation resistance of 5G ohm.
2833576 by Phoenix Contact

2833576

Phoenix Contact

RELAY SOCKET; Device Type Used On: RELAY;
ICM-624-1-GT by Adam Tech

ICM-624-1-GT

Adam Tech

ICM-624-1-GT by Adam Tech is a DIP24 IC socket with 24 contacts, 15.24mm PCB row spacing, and rectangular contact pattern. It has a solder termination type, operates b/w -40°C to 105°C, and supports a current rating of 3A. Ideal for applications requiring reliable chip carrier connections in electronic devices.
HLT-1712-G-R by Samtec

HLT-1712-G-R

Samtec

The Samtec HLT-1712-G-R is a plastic IC socket with 204 brass contacts. It features gold over nickel contact finish for mating and termination. Designed for use on PGA204 devices, this chip carrier socket is ideal for high-performance electronic applications.
XR2C-3201-N by Omron

XR2C-3201-N

Omron

IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2;
410-83-220-10-001101 by Preci-dip Sa

410-83-220-10-001101

Preci-dip Sa

410-83-220-10-001101 by Preci-dip Sa is a chip carrier IC & component socket with a GLASS FILLED POLYESTER housing material. It is used on DIP20 devices and has a min operating temperature of -55°C. With 20 contacts, it has an insulation resistance of 10^10 ohm and can handle a current rating of 1A.
342-90-156-00-593000 by Mill-max Mfg

342-90-156-00-593000

Mill-max Mfg

Mill-max Mfg's 342-90-156-00-593000 is a POLYETHYLENE chip carrier IC socket for SIP56 devices with 56 contacts. Features TIN LEAD (200) mating finish over NICKEL (150) and Tin/Lead termination with Nickel barrier. Ideal for rectangular contact configuration in electronic applications.
PL20 by Omron

PL20

Omron

RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
95.15.2 by Finder

95.15.2

Finder

Finder's 95.15.2 is a RELAY SOCKET with 8 contacts, rated at 10A current. It has a PCB contact row spacing of 7.49mm and operates b/w -40 to 70°C. Ideal for applications requiring reliable relay connections in electronic circuits.
1-390261-4 by TE Connectivity

1-390261-4

TE Connectivity

TE Connectivity 1-390261-4 is a Chip Carrier IC Socket with 16 contacts, 7.62mm PCB row spacing, and glass-filled PBT housing material. It is used for DIP16 devices, has a solder termination type, and operates b/w -40°C to 105°C. Ideal for applications requiring a mating contact pitch of 0.1 inch and insulation resistance of 1 Gohm at 1000VAC dielectric voltage withstand.
315-43-103-41-001000 by Mill-max Mfg

315-43-103-41-001000

Mill-max Mfg

The Mill-max Mfg 315-43-103-41-001000 is a PLASTIC IC SOCKET for SIP3 devices with 3 TIN contacts. It features RECTANGLE contact configuration and is ideal for Chip Carrier IC & Component Sockets applications.
210-93-308-41-001000 by Mill-max Mfg

210-93-308-41-001000

Mill-max Mfg

210-93-308-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with PCT Polyester housing and Beryllium Copper contacts. It is designed for DIP8 devices, featuring 8 contacts with Tin/Lead finish. Ideal for applications requiring reliable connection in electronic circuits.
MPAS-069-ZHGT-11 by Samtec

MPAS-069-ZHGT-11

Samtec

Samtec's MPAS-069-ZHGT-11 is a PGA69 IC socket with 69 contacts, 2.54mm terminal pitch, and rectangular PCB contact pattern. It features polyester housing material, solder termination type, and operates b/w -65°C to 125°C. Ideal for chip carrier applications requiring a mating contact pitch of 0.1 inch and insulation resistance of 5G ohm.
24-6554-10 by Aries Electronics

24-6554-10

Aries Electronics

Aries Electronics 24-6554-10 is a DIP36 IC socket with 24 contacts, PCB contact spacing of 15.24mm, and polyphenylene sulfide housing material. It has a mating pitch of 0.1", beryllium copper alloy contacts, and matte tin finish for solder termination. Ideal for applications requiring high insulation resistance and dielectric voltage withstand up to 1000VAC at temperatures up to 105°C.
416-43-260-41-003000 by Mill-max Mfg

416-43-260-41-003000

Mill-max Mfg

416-43-260-41-003000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP60 devices with 60 contacts and TIN finish. It features RECTANGLE contact configuration, ideal for Chip Carrier IC & Component Sockets applications.
YFS-20-03-H-05-SB-K by Samtec

YFS-20-03-H-05-SB-K

Samtec

YFS-20-03-H-05-SB-K by Samtec is a Chip Carrier IC Socket with 100 contacts. It features Phosphor Bronze contact material with Gold over Nickel finish. The housing material is Liquid Crystal Polymer, suitable for BGA100 devices.