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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | DLPC2607ZVB |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 176; Package Code: VFBGA; Package Shape: SQUARE; |
| Datasheet | DLPC2607ZVB Datasheet |
| In Stock | 496 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .95 V |
| Other Names: |
296-37291-6INACTIVE -296-37291-1 296-37291 2156-DLPC2607ZVB 296-37291-6 296-37291-1 296-37291-2 -296-37291-1-ND TEXTISDLPC2607ZVB 296-37291-2-ND 296-37291-1-ND 296-37291-6-ND 296-37291-2INACTIVE |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Nominal Supply Voltage: | 1 V |
| Maximum Supply Voltage: | 1.05 V |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -30 Cel |
| No. of Terminals: | 176 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B176 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | VFBGA |
| Temperature Grade: | OTHER |
| Moisture Sensitivity Level (MSL): | 3 |









