Texas Instruments - DLPC3434CZVB

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DLPC3434CZVB by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number DLPC3434CZVB
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 176; Package Code: VFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;
Datasheet DLPC3434CZVB Datasheet
In Stock1,165
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1 mm
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
JESD-609 Code: e1
No. of Terminals: 176
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Length: 7 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B176
Package Shape: SQUARE
Terminal Form: BALL
Peak Reflow Temperature (C): 260
Package Code: VFBGA
Width: 7 mm
Terminal Pitch: .4 mm
Moisture Sensitivity Level (MSL): 3
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Pricing (USD)

Qty. Unit Price Ext. Price
1,165 $3.460 $4,030.784

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