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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | DLPC350ZFF |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 419; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | DLPC350ZFF Datasheet |
In Stock | 2,149 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 3.135 V |
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | 3.3 V |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Supply Voltage: | 3.465 V |
Maximum Seated Height: | 2.36 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | 0 Cel |
No. of Terminals: | 419 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
No. of I/O Lines: | 14 |
Length: | 23 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B419 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Package Code: | BGA |
Width: | 23 mm |
Terminal Pitch: | 1 mm |
Temperature Grade: | OTHER |