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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | DM76S64BWF/J883B |
Description | Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Technology: TTL; |
Datasheet | DM76S64BWF/J883B Datasheet |
In Stock | 4,586 |
NAME | DESCRIPTION |
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Package Body Material: | CERAMIC |
Sub-Category: | Other Memory ICs |
Surface Mount: | NO |
Terminal Finish: | Tin/Lead (Sn/Pb) |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -55 Cel |
No. of Terminals: | 16 |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP16,.3 |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Screening Level: | 38535Q/M;38534H;883B |
Technology: | TTL |
JESD-30 Code: | R-XDIP-T16 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 125 Cel |
Package Code: | DIP |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | MILITARY |