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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | DM8147SCIS0 |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 684; Package Code: HBGA; Package Shape: SQUARE; |
Datasheet | DM8147SCIS0 Datasheet |
In Stock | 3,486 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 3.14 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3.3 V |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 3.06 mm |
Surface Mount: | YES |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
No. of Terminals: | 684 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B684 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 90 Cel |
Package Code: | HBGA |
Width: | 23 mm |
Moisture Sensitivity Level (MSL): | 4 |
Speed: | 1000 rpm |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Maximum Supply Voltage: | 3.47 V |
External Data Bus Width: | 48 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
Length: | 23 mm |
Additional Features: | IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY |
Peak Reflow Temperature (C): | 250 |
Bus Compatibility: | ETHERNET; I2C; SPI; UART; USB |
Terminal Pitch: | .8 mm |
Temperature Grade: | OTHER |