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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | DM8147SCIS0 |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 684; Package Code: HBGA; Package Shape: SQUARE; |
| Datasheet | DM8147SCIS0 Datasheet |
| In Stock | 368 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 3.14 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | 3.06 mm |
| Surface Mount: | YES |
| Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
| No. of Terminals: | 684 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B684 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 90 Cel |
| Package Code: | HBGA |
| Width: | 23 mm |
| Moisture Sensitivity Level (MSL): | 4 |
| Speed: | 1000 rpm |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Maximum Supply Voltage: | 3.47 V |
| External Data Bus Width: | 48 |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | 0 Cel |
| Length: | 23 mm |
| Additional Features: | IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY |
| Peak Reflow Temperature (C): | 250 |
| Bus Compatibility: | ETHERNET; I2C; SPI; UART; USB |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | OTHER |









