Texas Instruments - DM8147SCIS0

DM8147SCIS0 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number DM8147SCIS0
Description MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 684; Package Code: HBGA; Package Shape: SQUARE;
Datasheet DM8147SCIS0 Datasheet
In Stock3,486
NAME DESCRIPTION
Minimum Supply Voltage: 3.14 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 3.06 mm
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals: 684
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Technology: CMOS
JESD-30 Code: S-PBGA-B684
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 90 Cel
Package Code: HBGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 4
Speed: 1000 rpm
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 3.47 V
External Data Bus Width: 48
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Length: 23 mm
Additional Features: IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY
Peak Reflow Temperature (C): 250
Bus Compatibility: ETHERNET; I2C; SPI; UART; USB
Terminal Pitch: .8 mm
Temperature Grade: OTHER
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