Texas Instruments - DRA788BSGABFQ1

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DRA788BSGABFQ1 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number DRA788BSGABFQ1
Description MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 367; Package Code: FBGA; Package Shape: SQUARE;
Datasheet DRA788BSGABFQ1 Datasheet
In Stock1,257
NAME DESCRIPTION
Minimum Supply Voltage: 1.02 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.06 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.82 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 367
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: S-PBGA-B367
Maximum Clock Frequency: 32 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: FBGA
Width: 15 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 1.11 V
External Data Bus Width: 32
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA167,22X22,26
Length: 15 mm
Peak Reflow Temperature (C): 250
Bus Compatibility: I2C(2), SPI(4), UART(3),
Terminal Pitch: .65 mm
Temperature Grade: AUTOMOTIVE
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