Texas Instruments - DRA829VMTGBALFRQ1

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DRA829VMTGBALFRQ1 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number DRA829VMTGBALFRQ1
Description SoC; Terminal Form: BALL; No. of Terminals: 827; Package Code: FBGA; Package Shape: SQUARE; Speed: 2000 rpm;
Datasheet DRA829VMTGBALFRQ1 Datasheet
In Stock3,378
NAME DESCRIPTION
Minimum Supply Voltage: .76 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: .8 V
Maximum Seated Height: 2.8 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 827
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: S-PBGA-B827
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: FBGA
Width: 24 mm
Moisture Sensitivity Level (MSL): 3
Speed: 2000 rpm
Peripheral IC Type: SoC
Maximum Supply Voltage: .84 V
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA827,29X29,32
Length: 24 mm
Peak Reflow Temperature (C): 250
Terminal Pitch: .8 mm
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Pricing (USD)

Qty. Unit Price Ext. Price
3,378 $83.231 $281,154.318

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