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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | DS250DF810ABVT |
Description | INTERFACE CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 135; Package Code: BGA; Package Shape: RECTANGULAR; |
Datasheet | DS250DF810ABVT Datasheet |
In Stock | 78 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -10 Cel |
No. of Functions: | 1 |
No. of Terminals: | 135 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
JESD-30 Code: | R-PBGA-B135 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | 260 |
No. of Channels: | 8 |
Package Code: | BGA |
Interface IC Type: | INTERFACE CIRCUIT |
Temperature Grade: | OTHER |
Moisture Sensitivity Level (MSL): | 3 |