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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | DS560DF810ALUR |
| Description | INTERFACE CIRCUIT; Terminal Form: BALL; No. of Terminals: 135; Package Code: LFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH; |
| Datasheet | DS560DF810ALUR Datasheet |
| In Stock | 886 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.2 V |
| Maximum Seated Height: | 1.55 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 135 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| JESD-30 Code: | R-PBGA-B135 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| No. of Channels: | 8 |
| Package Code: | LFBGA |
| Interface IC Type: | INTERFACE CIRCUIT |
| Width: | 8 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Package Equivalence Code: | BGA135,9X15,32 |
| Length: | 13 mm |
| Additional Features: | ALSO REQUIRED 1.8V SUPPLY NOMINAL |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |
