Texas Instruments - HPA00023GKFR

HPA00023GKFR by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number HPA00023GKFR
Description D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 114; Package Code: LFBGA; Package Shape: RECTANGULAR;
Datasheet HPA00023GKFR Datasheet
In Stock4,508
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 20
Maximum Seated Height: 1.4 mm
Trigger Type: POSITIVE EDGE
Minimum Supply Voltage (Vsup): 2.3 V
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 114
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B114
Package Shape: RECTANGULAR
Terminal Form: BALL
Minimum fmax: 200 MHz
Maximum Operating Temperature: 70 Cel
Package Code: LFBGA
Width: 5.5 mm
Moisture Sensitivity Level (MSL): 3
No. of Bits: 24
Output Polarity: TRUE
Logic IC Type: D FLIP-FLOP
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
No. of Functions: 1
Length: 16 mm
Propagation Delay (tpd): 3.1 ns
Nominal Supply Voltage / Vsup (V): 2.5
Family: SSTV
Peak Reflow Temperature (C): 220
Terminal Pitch: .8 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 2.7 V
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Pricing (USD)

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