Texas Instruments - HPA01220DBZR

HPA01220DBZR by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number HPA01220DBZR
Description OTP ROM; Temperature Grade: OTHER; No. of Terminals: 3; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
Datasheet HPA01220DBZR Datasheet
In Stock587
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 1KX1
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1.12 mm
Minimum Supply Voltage (Vsup): 2.65 V
Surface Mount: YES
Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)
No. of Terminals: 3
No. of Words: 1024 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
Technology: CMOS
JESD-30 Code: R-PDSO-G3
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: SOP
Width: 1.3 mm
Moisture Sensitivity Level (MSL): 1
Memory Density: 1024 bit
Memory IC Type: OTP ROM
JESD-609 Code: e4
Minimum Operating Temperature: -20 Cel
Memory Width: 1
No. of Functions: 1
Length: 2.92 mm
No. of Words Code: 1K
Nominal Supply Voltage / Vsup (V): 3
Peak Reflow Temperature (C): 260
Parallel or Serial: SERIAL
Terminal Pitch: .95 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 5.5 V
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